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Synthesis of Composite Polystyrene/Silica Nanoparticles via Precipitation and Emulsion Polymerization Methods
Author(s) -
Kotti Katerina,
Kiparissides Costas
Publication year - 2010
Publication title -
macromolecular reaction engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.37
H-Index - 32
eISSN - 1862-8338
pISSN - 1862-832X
DOI - 10.1002/mren.200900054
Subject(s) - precipitation polymerization , emulsion polymerization , polystyrene , monomer , materials science , polymerization , chemical engineering , nanoparticle , polymer chemistry , composite number , polymer , particle size , emulsion , particle (ecology) , precipitation , colloidal silica , radical polymerization , composite material , nanotechnology , coating , oceanography , physics , geology , meteorology , engineering
Polystyrene/silica composite nanoparticles were synthesized via precipitation and emulsion polymerization methods, in the presence of a basic co‐monomer (e.g., 4‐VP and 1‐VID), and a colloidal aqueous silica solution. The effects of key process parameters, that is, solvent type, monomer/co‐monomer volume ratio and total monomers concentration for precipitation polymerization, and reaction temperature, pH value, initial silica‐sol concentration and initial monomer/co‐monomer molar ratio for emulsifier‐free emulsion polymerization on the particle morphology, silica content, and particle size distribution of the composite nanoparticles were experimentally investigated. Stable, spherical, and uniform in size composite nanoparticles were synthesized by both techniques. The average particle diameter varied from 108 to 182 nm for the emulsifier‐free emulsion polymerization and from 400 to 800 nm for the precipitation polymerization, while the silica content was as high as 38.3 wt.‐% for the former method and up to 15.5 wt.‐% for the later. The synthesized composite polymer/silica particles were then electrolytically co‐deposited with zinc on steel plates to improve the corrosion resistance of the metal's surface.