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New three‐configuration fet deembedding method
Author(s) -
Gerard H.,
Mouquet Y.
Publication year - 1993
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.4650061414
Subject(s) - electronic engineering , embedding , equivalent circuit , engineering , scaling , electrical engineering , computer science , mathematics , voltage , geometry , artificial intelligence
We have developed a new de‐embedding method for III‐V VET chips designed without a via hole. This method makes accurate measurement of access wire inductances and pad capacitances possible, without the need for any simplifying assumptions regarding the equivalent circuit [1] or additional scaling developments [2]. © 1993 John Wiley & Sons, Inc.
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