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Low‐impedance matching: The straight stub solution
Author(s) -
Giannini F.,
Bartolucci G.,
Ruggieri M.
Publication year - 1989
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.4650020307
Subject(s) - stub (electronics) , modal , planarity testing , electrical impedance , electronic engineering , impedance matching , electromagnetic simulation , matching (statistics) , engineering , modal analysis , computer science , topology (electrical circuits) , finite element method , electrical engineering , mathematics , structural engineering , materials science , statistics , combinatorics , polymer chemistry
The requirement of low impedances in most integrated circuits is solved through the use of straight stubs, treating them as one‐dimensional structures. The inadequacy of that approach can be overcome by adopting a complete modal theory—and the corresponding synthesis tools—developed to characterize those electromagnetic aspects deriving from the “planarity” of the structure. The simulations performed adopting both commercial CAD packages and the modal approach have been compared with some experiments and the need for a better characterization for the presently available cross‐junction element models has been pointed out.

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