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A dynamic model for printed circuit crossover interconnects
Author(s) -
Yang HungYu,
Alexopoulos Nicolaos G.
Publication year - 1988
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.4650010911
Subject(s) - crossover , electronic engineering , very large scale integration , chip , microwave , electronic circuit , engineering , electrical engineering , computer science , telecommunications , artificial intelligence
Abstract Crossover printed conductors may be used as multilevel chip‐to‐chip interconnects for high‐frequency high‐speed circuits, in VLSI applications, microwave directional couplers, etc. A theoretical model for crossover interconnects is presented in this article. The model accounts for dispersion effects and radiation loss and it may be used for the design of maximum or minimum power transfer between interconnects.