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A simplified cascade‐based de‐embedding technique for on‐wafer microwave characterization of thin‐film resistors and transmission lines
Author(s) -
Wei Zhennan,
Huang Fengyi,
Tang Xusheng,
Jiang Nan
Publication year - 2021
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.32977
Subject(s) - resistor , microwave , cascade , wafer , electric power transmission , electronic engineering , characterization (materials science) , materials science , embedding , optoelectronics , transmission line , electrical engineering , engineering , computer science , telecommunications , nanotechnology , voltage , chemical engineering , artificial intelligence
A cascade‐based de‐embedding technique is presented for microwave characterization of thin‐film resistors and transmission lines. Parasitic effects of the probe pads, on‐chip interconnects and access via holes can be directly extracted using two devices under test without resorting to any additional Open/Thru dummy structures. The proposed matrix transformation provides a simplified de‐embedding methodology with a high precision similar to the conventional approaches using multiple dummy structures. The validity of the proposed technique has been demonstrated for GaN thin‐film resistors up to 65 GHz.