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Large‐scale transient electrical‐thermal co‐simulation of interconnects under electromagnetic pulses
Author(s) -
Lu Tianjian,
Jin JianMing
Publication year - 2016
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.30097
Subject(s) - transient (computer programming) , electrostatic discharge , thermal , microwave , materials science , mechanics , electrical engineering , optoelectronics , electronic engineering , acoustics , engineering , mechanical engineering , physics , voltage , computer science , telecommunications , thermodynamics , operating system
The electrical‐thermal co‐simulation is employed to analyze the transient electrical and thermal behaviors of large‐scale on‐chip and 3‐D interconnects. The analyses are performed when the interconnects are exposed to electromagnetic pulses in order to simulate both self‐heating effects under normal working conditions and thermal breakdowns under electrostatic discharge stresses. The impact of power maps on the transient thermal responses under the electrostatic discharge stress is also studied. © 2016 Wiley Periodicals, Inc. Microwave Opt Technol Lett 58:2559–2563, 2016