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Modeling the package of a LNA with a 3D‐EM simulator
Author(s) -
GarcíaVázquez Hugo,
Khemchandani Sunil L.,
RamosValido Dailos,
OrbaicetaEzcurra Krisnaya,
del Pino Javier
Publication year - 2013
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.27601
Subject(s) - node (physics) , inductance , electronic circuit simulation , microwave , electronic engineering , low noise amplifier , electrical engineering , computer science , simulation , amplifier , engineering , voltage , electronic circuit , telecommunications , cmos , structural engineering
In this work, the package influence on a feedback low‐noise amplifier has been studied.The electromagnetic simulator of ADS was used to obtain the QFN16 package model and the bonding model. The influence of the package and the pad on the supply node was negligible when it was studied separately. However, the circuit performance is reduced when the inductance introduced by the bonding of the supply node is combined with the parasitic capacities associated to the pad with electrostatic discharge protection. © 2013 Wiley Periodicals, Inc. Microwave Opt Technol Lett 55:1435–1440, 2013; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.27601