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Pad‐to‐pad isolation of vertical interconnects using magnetically aligned anisotropic conductive adhesive
Author(s) -
Moon Sungwook
Publication year - 2012
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.27153
Subject(s) - materials science , capacitance , electrical conductor , inductance , optoelectronics , printed circuit board , soldering , interconnection , adhesive , equivalent series resistance , electrical engineering , capacitive coupling , composite material , electrode , voltage , engineering , physics , telecommunications , layer (electronics) , quantum mechanics
Self‐alignment of vertical interconnects using a magnetically aligned anisotropic conductive adhesive (MA‐ACA) is a unique method, which is useful in high‐density electronic applications.This material is created by magnetic interaction between loading conductive particles in an epoxy medium. To analyze electromagnetic interference between adjacent I/O pads, a lumped component model was suggested, consisting of shunt capacitance, parallel capacitance, series resistance, series inductance, and coupling capacitance. The equivalent circuit model was validated through the measurement of test samples with MA‐ACA interconnects. Also, the pad‐to‐pad isolation of the MA‐ACA was compared to that of lead/tin solder connections. As a result, at high frequencies the pad‐to‐pad isolation of the MA‐ACA interconnects was observed to be mainly degraded by a larger coupling capacitance due to the presence of metallic interconnects at a transition region. Therefore, a packaging approach using the characterized RF performance of the MA‐ACA interconnects is expected to be designed for high‐density electronic circuitry. © 2012 Wiley Periodicals, Inc. Microwave Opt Technol Lett 54:2606–2610, 2012; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.27153