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Demonstration of a 5 Gb/s × 24 interchip optical interconnect system
Author(s) -
Feng Quanyou,
Sang Xinzhu,
Dou Wenhua
Publication year - 2012
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.26754
Subject(s) - microlens , photodiode , materials science , optoelectronics , interconnection , optical fiber , optical interconnect , microprocessor , printed circuit board , vertical cavity surface emitting laser , microwave , coupling (piping) , optics , laser , electrical engineering , engineering , physics , lens (geology) , telecommunications , metallurgy
An 850 nm 12‐channel vertical cavity surface emitting laser array, a photodiode array, microprocessor chips, embedded fiber‐optic waveguides, and microlens optical coupling elements are integrated onto the printed circuit board. The bidirectional 5 Gb/s × 24 optical interconnect system is successfully demonstrated for interprocessor communication through optical I/O pins. © 2012 Wiley Periodicals, Inc. Microwave Opt Technol Lett 54:1176–1179, 2012