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Compact LTCC bandpass filter with vertically folded structure
Author(s) -
Chin KuoSheng,
Hung JianLuen,
Huang ChunWei,
Fu Jeffrey S.,
Karmakar Nemai C.
Publication year - 2011
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.26024
Subject(s) - chebyshev filter , band pass filter , stub (electronics) , microwave , electronic engineering , fabrication , microstrip , materials science , ceramic , engineering , optoelectronics , electrical engineering , telecommunications , medicine , alternative medicine , pathology , composite material
This work designs miniaturized stub‐type microstrip bandpass filters and develops a novel vertical interconnection scheme in a multilayer structure to design vertically folded filters for size reduction. The current study exploits the fabrication process of low‐temperature cofired ceramic (LTCC) for filter realization and fabricates two LTCC Chebyshev stub‐type filters at 28 GHz and 5.8 GHz to verify effectiveness of the proposed structure with a maximum size reduction of 50%. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:1389–1394, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.26024