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Analysis of substrate integrated waveguide structures VIA a periodic transverse‐wave iterative formulation
Author(s) -
Brahim Taoufik Ibn Elhaj,
Zairi H.,
Gharsallah A.,
Gharbi A.,
Baudrand H.
Publication year - 2011
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.25873
Subject(s) - microwave , transverse plane , waveguide , iterative method , substrate (aquarium) , boundary value problem , electrical impedance , physics , transverse mode , materials science , optics , mathematical analysis , computational physics , mathematics , engineering , algorithm , quantum mechanics , structural engineering , geology , oceanography , laser
In this article, the theory and numerical algorithm of a periodic wave concept iterative method are presented for the analysis of periodic structures of metallic via‐holes. The method is based on the transverse wave formulation using the periodic boundary conditions to extract the single via‐hole's impedance. As application a substrate integrated waveguide structures are studied. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:880–884, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.25873