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SMT pad using a coaxial line structure for LTCC SoP applications
Author(s) -
Lee Young Chul
Publication year - 2009
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.24447
Subject(s) - microwave , coaxial , return loss , electrical engineering , crosstalk , engineering , electrical conductor , printed circuit board , optoelectronics , materials science , surface mount technology , electronic engineering , telecommunications , antenna (radio)
In this work, a SMT (surface mount type) pad using a coaxial‐line‐like vertical via transition is presented for LTCC SoP (system‐on‐package) applications. Because the outer conductors of the coaxial‐like transition overlaps with the CPW line on the PCB board, the overlap part is cut off to eliminate the their interaction or crosstalk. For reduction of radiation and return path, a cap on the top layer of the LTCC substrate is designed. The designed SMT pad was fabricated using the standard LTCC process. The measured S 11 and S 21 are −14 and 0.9 dB, respectively, at 15 GHz. © 2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 51: 1769–1772, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24447