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Improving the solution accuracy of thin dielectric approximation with a vertical electric field component
Author(s) -
Lu CaiCheng
Publication year - 2008
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.23518
Subject(s) - dielectric , integral equation , scattering , component (thermodynamics) , field (mathematics) , microwave , mathematical analysis , surface (topology) , current (fluid) , electric field , volume (thermodynamics) , materials science , computational physics , mathematics , optics , physics , thermodynamics , geometry , optoelectronics , quantum mechanics , pure mathematics
The traditional thin dielectric sheet approximation (TDS) method models the electromagnetic scattering by thin dielectric sheet using surface integral equation. In this approximation, only the tangential current within the dielectric sheet is considered, and the vertical component is ignored. This article proposes a method that uses the volume integral equation solution to predict the vertical volume current and hence to improve the overall solution accuracy. The formulation is based on the hybrid surface (SIE) and volume integration equation (VIE) in which, the thin dielectric is modeled with SIE, and the thin layers are modeled by VIE. It is shown that the inclusion of the vertical current component does not increase memory and solution time. Numerical examples will be provided to demonstrate the effectiveness of this approach. © Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 1978–1982, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23518