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Investigation of return loss for large numbers of bonding wires by FDTD method
Author(s) -
Chen HsingYi,
Su ChiehPin
Publication year - 2008
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.23425
Subject(s) - hfss , return loss , finite difference time domain method , microwave , wire bonding , materials science , substrate (aquarium) , optics , electrical engineering , engineering , telecommunications , physics , microstrip antenna , antenna (radio) , chip , oceanography , geology
Abstract The finite‐difference time domain (FDTD) model is validated first by comparing the simulation results of return losses for 1, 7, and 15 bonding wires fabricated on a test board with those obtained by the HFSS software. After checking its accuracy, the FDTD method is used to investigate the return loss for bonding wire arrays with numerous geometrical parameters. From simulation results, it is found that the return loss of bonding wires can be improved by using multiple wires placed in parallel in bonding wire arrays. It is also found that operation frequency shifts of bonding wire arrays can be achieved by changing the wire numbers in bonding wire arrays. It is also reveled that the return loss of bonding wire structures is a function of the bonding wire geometry, such as the spacing between adjacent wires, wire number, wire height above the substrate, and wire length. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 1575–1579, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23425