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High‐frequency characterization of packaging network in TO‐CAN photodiode modules
Author(s) -
Zhu N. H.,
Wen J. M.,
Zhang S. J.
Publication year - 2008
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.23356
Subject(s) - photodiode , microwave , scattering parameters , electronic engineering , chip , optoelectronics , engineering , materials science , electrical engineering , telecommunications
Abstract A simple method for analyzing the effects of TO packaging network on the high‐frequency response of photodiode modules is presented. This method is established based on the relations of the scattering parameters of the packaging network, photodiode chip, and module. It is shown that the results obtained by this method agree well with those obtained by the conventional comparison method. The proposed method is much more convenient since only the electrical domain measurements are required. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 1219–1223, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23356