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Low‐loss and broadband BGA package transition for LTCC‐SiP applications
Author(s) -
Kangasvieri T.,
Halme J.,
Vähäkangas J.,
Lahti M.
Publication year - 2008
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.23276
Subject(s) - ball grid array , motherboard , soldering , materials science , insertion loss , broadband , microwave , ceramic , printed circuit board , interposer , return loss , optoelectronics , electrical engineering , reliability (semiconductor) , system in package , electronic engineering , engineering , composite material , telecommunications , chip , physics , power (physics) , etching (microfabrication) , layer (electronics) , quantum mechanics , antenna (radio)
A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the K a ‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 1036–1040, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23276