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Erratum: Application of the Foldy‐Lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards
Author(s) -
Ong C.J.,
Tsang L.
Publication year - 2008
Publication title -
microwave and optical technology letters
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.23005
Subject(s) - microwave , grid , printed circuit board , scattering , ball (mathematics) , engineering , ball grid array , electrical engineering , engineering physics , telecommunications , materials science , optics , physics , mathematics , composite material , geometry , soldering
Originally published Microwave Opt Technol Lett 49 (2007), 225–231. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 263, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23005
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