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Optimization of integrated circuits placement for electric field reduction inside telecommunications equipment using Monte Carlo simulation and parallel recombinative simulated annealing
Author(s) -
Goudos Sotirios K.,
Zaharis Zaharias D.,
Lazaridis Pavlos I.,
Gallion Philippe B.
Publication year - 2007
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.22893
Subject(s) - simulated annealing , monte carlo method , electromagnetic interference , telecommunications equipment , electronic engineering , electromagnetic compatibility , electronic circuit , enclosure , engineering , microwave , emi , reduction (mathematics) , electromagnetic shielding , electrical engineering , computer science , telecommunications , algorithm , statistics , geometry , mathematics
This article presents a novel approach to the modeling and reduction of electromagnetic interference (EMI) caused by radiated emissions of integrated circuits (ICs) inside rectangular metallic enclosures of telecommunications devices. This type of analysis applies for several types of modern telecommunications equipment found in high‐speed networks as well as in mobile communications. A generic model of such a device is created. The ICs are modeled as small electric dipoles and their interaction with the enclosure walls is studied by using the dyadic Green's functions. The electric field on the enclosure walls is computed and its reduction is studied as optimization problem using evolutionary algorithms. Two algorithms are employed: Genetic algorithms (GAs) and parallel recombinative simulated annealing (PRSA). PRSA is a hybrid evolutionary strategy that inherits properties from both GAs and simulated annealing. Monte Carlo simulation is subsequently applied to the optimization results to derive the electric field on the metallic walls and also to perform a worst‐case analysis. The applications of the above approach in early PCB design process are discussed. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 3049–3055, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22893