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Erratum: Application of the Foldy‐Lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards
Author(s) -
Ong C.J.,
Tsang L.
Publication year - 2007
Publication title -
microwave and optical technology letters
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.22804
Subject(s) - microwave , printed circuit board , grid , ball grid array , engineering , electrical engineering , electronic engineering , materials science , telecommunications , composite material , mathematics , soldering , geometry
Originally published Microwave Opt Technol Lett 49:225–231. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 2887, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22804
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