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60 GHz multi‐chip module based on cost effective hybrid multilayer PWB
Author(s) -
Choi Sung Tae,
Hamaguchi Kiyoshi,
Ogawa Hiroyo,
Tokuda Kiyohito,
Kim Yong Hoon
Publication year - 2007
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.22719
Subject(s) - microwave , millimetre wave , chip , extremely high frequency , optoelectronics , materials science , printed circuit board , dielectric , monolithic microwave integrated circuit , electronic engineering , electrical engineering , engineering , telecommunications , cmos , amplifier
A novel cost‐effective 60‐GHz multi‐chip module (MCM) is proposed and demonstrated. It is based on a low‐cost multilayer printed wiring board (PWB) with a novel vertical transition and a single layer waveguide transition which enables the use of low‐cost substrates with high dielectric loss for millimeter wave applications. The proposed MCM technology has been successfully applied to the packaging of a 60‐GHz self‐heterodyne mixer, and no substantial difference in the RF performance is observed with the packaging. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 2303–2305, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22719