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Calculations of return loss of bonding wires fabricated on a test board by FDTD method
Author(s) -
Chen HsingYi,
Su ChiehPin
Publication year - 2007
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.22546
Subject(s) - hfss , finite difference time domain method , microwave , return loss , software , printed circuit board , materials science , electronic engineering , engineering , computer science , electrical engineering , optics , physics , telecommunications , microstrip antenna , antenna (radio) , programming language
Return losses of bonding wires fabricated on a test board for RF and microwave circuit applications are studied by the finite‐difference time‐domain (FDTD) method. Simulation results of return losses obtained by the FDTD method are presented and compared with those obtained by the HFSS software and measurements at frequencies of 0.04–6 GHz. It is found that simulation results calculated by the FDTD method make a good agreement with those obtained by the HFSS software. Results of the FDTD method are also further validated by the measurement data. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 1603–1606, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22546