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RF balun embedded in multilayer organic substrate
Author(s) -
Ihm JaeYong,
Hwang KyuPyung
Publication year - 2007
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.22163
Subject(s) - balun , microwave , bluetooth , substrate (aquarium) , electronic component , electrical engineering , electronic engineering , engineering , port (circuit theory) , optoelectronics , materials science , telecommunications , wireless , antenna (radio) , oceanography , geology
This letter presents the design, modeling, and characterization of a RF balun embedded in multilayer organic substrate. A Marchand‐type balun for 2.4‐GHz Bluetooth and WLAN applications has been designed and fabricated using the low cost organic package technology. Its four‐port measurement results show good electrical performance and close correlation with full‐wave simulation data demonstrating the successful implementation of the RF passive component completely integrated in build‐up layers of an organic package substrate. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 473–475, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22163