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Evaluation of microwave material of low K interconnection for RF package
Author(s) -
Weng MinHang,
Wu HungWei,
Su YanKuin,
Yang RuYuan,
Hung ChengYuan
Publication year - 2006
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.21707
Subject(s) - interconnection , polyimide , microwave , dielectric , materials science , dissipation factor , capacitance , dielectric loss , optoelectronics , electronic engineering , microwave transmission , transmission line , electrical engineering , composite material , engineering , telecommunications , physics , layer (electronics) , electrode , quantum mechanics
Abstract In this paper, microwave material properties such as dielectric constant and loss tangent of polyimide dielectric as interconnection for multi‐chip‐module (MCM) or system‐in‐package (SIP) are investigated. Instead of using conventional parallel‐plate capacitance measurement, a transmission line method is used to characterize the microwave material properties of polyimide dielectric up to 50 GHz. The dielectric constant and loss tangent of polyimide dielectric are averagely 2.5 and 0.06 from 5 to 50 GHz, respectively. The microwave evolution in this work shows the polyimide dielectric has high potential to be a microwave interconnection for high‐speed and high‐frequency circuits in MCM and SIP. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 1675–1678, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21707