Construction of an RF‐band test fixture model using 3‐D field simulator | Zendy

Kim KiHyuk | Zendy; Kim GyoungBum | Zendy; Cha Seung Yong | Zendy; Hwang SungWoo | Zendy

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Construction of an RF‐band test fixture model using 3‐D field simulator

Author(s) -

Kim KiHyuk,

Kim GyoungBum,

Cha Seung Yong,

Hwang SungWoo

Publication year - 2006

Publication title -

microwave and optical technology letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.304

H-Index - 76

eISSN - 1098-2760

pISSN - 0895-2477

DOI - 10.1002/mop.21390

Subject(s) - test fixture , fixture , engineering , microwave , planar , amplifier , electronic circuit simulation , electronic engineering , coaxial , monolithic microwave integrated circuit , field (mathematics) , electrical engineering , mechanical engineering , computer science , electronic circuit , telecommunications , computer graphics (images) , mathematics , cmos , pure mathematics

For design and characterization of packaged RF‐band transistor amplifiers, test fixtures consisting of coaxial connectors and planar‐type transmission lines are frequently used. We present a method of extracting 3D field simulation parameters of these test fixtures and demonstrate that a circuit model of the test fixtures can be constructed by pure 3D field simulation using the extracted material constants. The developed circuit model predicts measurement results within 0.5 dB. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 498–500, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21390

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