Packaging for a FP‐LD hybrid transceiver using filter‐integrated PLC platform with PD insertion trench | Zendy

Moon Sungwook | Zendy; Han Sub | Zendy; Choi JungHo | Zendy; Shin SangGil | Zendy; Margalit Moti | Zendy; Avni Eitan | Zendy; Rogovsky Gideon | Zendy

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Packaging for a FP‐LD hybrid transceiver using filter‐integrated PLC platform with PD insertion trench

Author(s) -

Moon Sungwook,

Han Sub,

Choi JungHo,

Shin SangGil,

Margalit Moti,

Avni Eitan,

Rogovsky Gideon

Publication year - 2006

Publication title -

microwave and optical technology letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.304

H-Index - 76

eISSN - 1098-2760

pISSN - 0895-2477

DOI - 10.1002/mop.21387

Subject(s) - transceiver , photodiode , insertion loss , wavelength division multiplexing , engineering , microwave , dbm , trench , electrical engineering , multiplexing , electronic engineering , filter (signal processing) , optoelectronics , materials science , wavelength , telecommunications , amplifier , cmos , layer (electronics) , composite material

We present the packaging of a 1.25‐Gb/s bidirectional transceiver using a filter‐integrated planar lightwave circuit (PLC) platform for passive optical networks. A simple packaging for a hybrid transceiver is successfully demonstrated by using a PLC platform with the trench for photodiode (PD) insertion and the adiabatic wavelength division multiplexing (WDM) filter. This transceiver exhibited full‐duplex operation of 1.25 Gb/s with a minimum optical sensitivity of −26.5 dBm under an output power of 0 dBm. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 489–491, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21387

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