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Characterization of the electrical performance of different signal via geometries
Author(s) -
Agili Sedig S.,
Smith Stephen B.,
Balasubramanian Vittal
Publication year - 2006
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.21336
Subject(s) - microwave , return loss , signal (programming language) , drill , transmission (telecommunications) , electrical impedance , time domain , electrical engineering , acoustics , engineering , characterization (materials science) , electronic engineering , materials science , physics , telecommunications , optics , computer science , mechanical engineering , antenna (radio) , computer vision , programming language
Several signal via geometries are analyzed for across and through transmission by varying the drill‐hole diameter, ratio of the pad and antipad diameters to drill‐hole diameter, and number of ground planes. Time‐ and frequency‐domain results showing impedance‐, insertion‐, and return‐loss trends, which are useful for designing via geometries for high‐speed transmission, are obtained. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 315–320, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21336