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Bonding‐wire compensation effect on the packaging parasitics of optoelectronic devices
Author(s) -
Zhu N. H.,
Liu Y.,
Zhang S. J.,
Wen J. M.
Publication year - 2006
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.21266
Subject(s) - parasitic extraction , wire bonding , optoelectronics , materials science , microwave , laser , laser diode , diode , photodiode , compensation (psychology) , electrical engineering , engineering , optics , chip , telecommunications , physics , psychology , psychoanalysis
The effect of bonding‐wire compensation on the capacitances of both the submount and the laser diode is demonstrated in this paper. The measured results show that the small‐signal magnitude‐frequency responses of the TO packaged laser and photodiode modules can be improved by properly choosing the length of the bonding wire. After packaging, the phase‐frequency responses of the laser modules can also be significantly improved. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 76–79, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21266