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A robust surface‐integral‐equation formulation for conductive media
Author(s) -
Chu YunHui,
Chew Weng Cho
Publication year - 2005
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.20916
Subject(s) - integral equation , weighting , microwave , range (aeronautics) , electrical conductor , surface integral , surface (topology) , mathematical analysis , mathematics , computer science , engineering , physics , materials science , geometry , electrical engineering , composite material , telecommunications , acoustics
A novel surface‐integral‐equation (SIE) formulation is proposed by tuning the weighting coefficients for the external‐ and internal‐region integral equations. Without increasing the computational cost, the present formulation significantly enlarges the solvable skin‐depth range. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 46: 109–114, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20916