A comparison of shielded and conventional on‐wafer test‐fixture forward coupling on silicon‐on‐insulator (SOI) substrate | Zendy

Kaija Tero | Zendy; Ristolainen Eero O. | Zendy

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A comparison of shielded and conventional on‐wafer test‐fixture forward coupling on silicon‐on‐insulator (SOI) substrate

Author(s) -

Kaija Tero,

Ristolainen Eero O.

Publication year - 2005

Publication title -

microwave and optical technology letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.304

H-Index - 76

eISSN - 1098-2760

pISSN - 0895-2477

DOI - 10.1002/mop.20727

Subject(s) - silicon on insulator , shielded cable , wafer , fixture , test fixture , microwave , substrate (aquarium) , coupling (piping) , materials science , electronic engineering , optoelectronics , electrical engineering , engineering , silicon , mechanical engineering , telecommunications , oceanography , geology

In this paper, ground‐shielded and conventional on‐wafer test‐fixture properties on a silicon‐on‐insulator (SOI) substrate are studied in microwave measurements. The ground‐shielded fixture exhibits over 60% lower forward‐coupling than the corresponding conventional fixture. Reduced forward‐coupling improves the test‐fixture scalability. Shielded in‐fixtures provide the correct parasitics needed for successful de‐embedding. This is validated by measurements. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 45: 70–75, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20727

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