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Frequency‐band selection for an integrated‐circuit package antenna using LTCC technology
Author(s) -
Wang J. J.,
Xue Y.,
Zhang Y. P.,
Chua K. M.,
Lu A. C. W.,
Wai Lai L.,
Wong C. K.
Publication year - 2005
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.20660
Subject(s) - ground plane , antenna (radio) , microwave , electrical engineering , microstrip antenna , engineering , transceiver , wireless , microstrip , electronic engineering , telecommunications
This paper describes an integrated‐circuit package antenna (ICPA) designed and fabricated using low‐temperature cofired ceramic (LTCC) technology for wireless transceivers. The ICPA features a shorting via for frequency‐band selection. The measured results show that the prototype ICPA with a size of 17 × 17 × 2 mm 3 operates at 5.37 GHz when the via is shorted to ground and at 5.67 GHz when the via is opened. The radiation patterns of the ICPA for both cases are similar to those of a conventional microstrip patch antenna on a small ground plane. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 44: 439–441, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20660