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Broadband planar integration and packaging for millimeter‐wave circuit design at the V‐band
Author(s) -
Yang Ki Seok,
Choi Sung Tae,
Tokuda Kiyohito,
Kim Yong Hoon
Publication year - 2005
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.20638
Subject(s) - insertion loss , microstrip , coplanar waveguide , microwave , broadband , wideband , extremely high frequency , materials science , planar , optoelectronics , bandwidth (computing) , electronic circuit , waveguide , interconnection , ribbon , monolithic microwave integrated circuit , center frequency , optics , electrical engineering , telecommunications , engineering , band pass filter , physics , amplifier , computer science , cmos , computer graphics (images) , composite material
A broadband planar integration and packaging of millimeter‐wave circuits based on the integrated waveguide (IWG) and grounded coplanar waveguide (GCPW) transitions are proposed and demonstrated at the V‐band. A novel wideband microstrip‐line‐to‐IWG transition is proposed for the planar integration of the rectangular waveguide devices and the insertion loss per one transition is less than 0.1 dB from 43 to 73 GHz. A proposed surface‐mountable filter has an insertion loss of 3 dB and a 3.3% bandwidth at a center frequency of 62 GHz. A broadband ribbon interconnection exhibits low loss of 0.2 dB from DC to 70 GHz and the insertion loss of a single microstrip‐to‐waveguide transition is less than 0.4 dB from 50 to 75 GHz. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 44: 371–374, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20638