High‐frequency characterization of coplanar waveguide and equivalent‐circuit modeling of interconnection for mini‐DIL package | Zendy

Han JaeHo | Zendy; Jeong Jichai | Zendy

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High‐frequency characterization of coplanar waveguide and equivalent‐circuit modeling of interconnection for mini‐DIL package

Author(s) -

Han JaeHo,

Jeong Jichai

Publication year - 2004

Publication title -

microwave and optical technology letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.304

H-Index - 76

eISSN - 1098-2760

pISSN - 0895-2477

DOI - 10.1002/mop.20470

Subject(s) - coplanar waveguide , return loss , microwave , equivalent circuit , interconnection , transmission line , scattering parameters , electrical impedance , electronic engineering , electrical engineering , bandwidth (computing) , engineering , optoelectronics , materials science , telecommunications , voltage , antenna (radio)

Coplanar‐waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini‐DIL package. For microwave‐circuit simulation of the package, equivalent electric‐circuit modeling of die‐attached components with wire‐bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted. © 2004 Wiley Periodicals, Inc. Microwave Opt Technol Lett 43: 365–367, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20470

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