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Shielding effect using cascaded metallic holes in microwave circuits
Author(s) -
Zeid A.,
Baudrand H.,
Peuch J. C.
Publication year - 2001
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.1168
Subject(s) - electromagnetic shielding , microwave , microelectronics , electronic circuit , square (algebra) , metal , electrical engineering , section (typography) , physics , materials science , electronic engineering , computational physics , optoelectronics , engineering , optics , telecommunications , computer science , mathematics , geometry , metallurgy , operating system
The problem of electromagnetic shielding between elements of microelectronic circuits has been studied by using a new technique (the via holes technique). Metallic squares and truncated square cross sections approximate each metallic circle cross section. A comparison between the adjacent and a staggered arrangement of via holes has been illustrated theoretically and experimentally. © 2001 John Wiley & Sons, Inc. Microwave Opt Technol Lett 29: 322–324, 2001.