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The influence of the bumping height on the performance of flip‐chipped CPW Lange couplers
Author(s) -
Carchon G.,
Nauwelaers B.
Publication year - 2001
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.1149
Subject(s) - bumping , microwave , coplanar waveguide , optoelectronics , engineering , electrical engineering , materials science , mechanical engineering , telecommunications
Abstract The influence of the bumping height on the performance of flip‐chipped CPW Lange couplers is investigated. The coupler design method is done by measurements of a coupler integrated in a multilayer thin‐film MCM‐D. The reasons for the detuning are identified, and solutions to easily predistort the design or reduce the detuning effect are given. © 2001 John Wiley & Sons, Inc. Microwave Opt Technol Lett 29: 263–267, 2001.