The influence of the bumping height on the performance of flip‐chipped CPW Lange couplers | Zendy

Carchon G. | Zendy; Nauwelaers B. | Zendy

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The influence of the bumping height on the performance of flip‐chipped CPW Lange couplers

Author(s) -

Carchon G.,

Nauwelaers B.

Publication year - 2001

Publication title -

microwave and optical technology letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.304

H-Index - 76

eISSN - 1098-2760

pISSN - 0895-2477

DOI - 10.1002/mop.1149

Subject(s) - bumping , microwave , coplanar waveguide , optoelectronics , engineering , electrical engineering , materials science , mechanical engineering , telecommunications

The influence of the bumping height on the performance of flip‐chipped CPW Lange couplers is investigated. The coupler design method is done by measurements of a coupler integrated in a multilayer thin‐film MCM‐D. The reasons for the detuning are identified, and solutions to easily predistort the design or reduce the detuning effect are given. © 2001 John Wiley & Sons, Inc. Microwave Opt Technol Lett 29: 263–267, 2001.

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