An efficient simulation technique for lossy substrate interconnects characterization | Zendy

Wu Dagang | Zendy; Chen Ji | Zendy

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An efficient simulation technique for lossy substrate interconnects characterization

Author(s) -

Wu Dagang,

Chen Ji

Publication year - 2004

Publication title -

microwave and optical technology letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.304

H-Index - 76

eISSN - 1098-2760

pISSN - 0895-2477

DOI - 10.1002/mop.11362

Subject(s) - lossy compression , microwave , substrate (aquarium) , transmission line , lanczos resampling , electronic engineering , characterization (materials science) , transmission (telecommunications) , computer science , materials science , engineering , telecommunications , physics , nanotechnology , oceanography , eigenvalues and eigenvectors , quantum mechanics , artificial intelligence , geology

In this paper, an efficient numerical simulation technique is introduced to extract the propagation characteristics of interconnects over lossy substrate structures. This approach is based on a compact‐form FDFD method in conjunction with the two‐step Lanczos (TSL) technique. The efficiency and accuracy of the algorithm are demonstrated through the simulation of several lossy transmission‐line structures. © 2004 Wiley Periodicals, Inc. Microwave Opt Technol Lett 40: 305–308, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11362

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