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Optimization of a small to‐can package electrical design for SFF/SFP optical transceiver modules
Author(s) -
Lee SangHoon,
Cho YongSang,
Koo BonJo,
Han SangKook
Publication year - 2003
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.11340
Subject(s) - transceiver , bandwidth (computing) , microwave , electronic engineering , package design , engineering , computer science , electrical engineering , telecommunications , engineering drawing , cmos
In this paper, we present an optimum TO‐38 package design for SFF/SFP optical transceiver modules in order to improve the 3‐dB bandwidth. The frequency response of the TO‐38 package is measured and compared to simulation where the 3‐dB‐bandwidth was 3.5 GHz. For a higher operating bandwidth (>15 GHz), new optimized physical geometries for the TO‐can package, such as bonding wires, leads, and material, are suggested. The optimal result of simulation shows that this TO‐can package can be used at a higher‐bit‐rate optical module of 10 Gb/s. © 2004 Wiley Periodicals, Inc. Microwave Opt Technol Lett 40: 239–242, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11340