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Multi‐layer microstrip antennas on quartz substrates: Technological considerations and performances at 60 GHz
Author(s) -
Coquet Ph.,
Sauleau R.,
Shinohara K.,
Lhermite H.,
Matsui T.
Publication year - 2003
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.11281
Subject(s) - materials science , fabrication , microstrip , optoelectronics , ground plane , microwave , quartz , microstrip antenna , wafer , optics , electronic engineering , antenna (radio) , electrical engineering , engineering , composite material , telecommunications , physics , medicine , alternative medicine , pathology
This paper describes the thin‐film fabrication process and the performance of 60‐GHz aperture‐coupled microstrip patch antennas printed on fused quartz substrates. It is shown that their characteristics (input impedance, axial ratio) are strongly modified by residual air gaps located between the two substrates of the antenna. In particular, FDTD simulations demonstrate that these parasitic effects can be minimized by using two ground/reflecting planes and by keeping the thickness of the air layer thinner than λ 0 /250, where λ 0 is the free‐space wavelength. To face this technological problem, two intermediate metal and adhesive (low‐temperature) wafer bonding techniques, respectively based on indium and polymer layers, have been developed and validated experimentally for linear and circular polarization patch antennas and arrays. The lift‐off fabrication process is also described. © 2004 Wiley Periodicals, Inc. Microwave Opt Technol Lett 40: 41–47, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11281