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RF SAW filter package design for wireless communications
Author(s) -
Finch Craig,
Yang Xiaomin,
Wu Thomas X.,
Abbott Benjamin
Publication year - 2003
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.11229
Subject(s) - microwave , engineering , wireless , electronic engineering , filter (signal processing) , electrical engineering , chip scale package , port (circuit theory) , electronic filter , ceramic , chip , finite element method , telecommunications , materials science , structural engineering , voltage , composite material
This paper describes a new method to design a ceramic chip and wire package for an RF SAW filter. Both the solid model of the package and bond wires are included in the full‐wave analysis. A novel port configuration is used in finite‐element simulation. Agreement between measurement and simulation is found to be excellent. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 39: 399–401, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11229