RF SAW filter package design for wireless communications | Zendy

Finch Craig | Zendy; Yang Xiaomin | Zendy; Wu Thomas X. | Zendy; Abbott Benjamin | Zendy

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RF SAW filter package design for wireless communications

Author(s) -

Finch Craig,

Yang Xiaomin,

Wu Thomas X.,

Abbott Benjamin

Publication year - 2003

Publication title -

microwave and optical technology letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.304

H-Index - 76

eISSN - 1098-2760

pISSN - 0895-2477

DOI - 10.1002/mop.11229

Subject(s) - microwave , engineering , wireless , electronic engineering , filter (signal processing) , electrical engineering , chip scale package , port (circuit theory) , electronic filter , ceramic , chip , finite element method , telecommunications , materials science , structural engineering , voltage , composite material

This paper describes a new method to design a ceramic chip and wire package for an RF SAW filter. Both the solid model of the package and bond wires are included in the full‐wave analysis. A novel port configuration is used in finite‐element simulation. Agreement between measurement and simulation is found to be excellent. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 39: 399–401, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11229

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