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Analysis of via discontinuity
Author(s) -
Chen Houfei,
Huang ChungChi,
Tsang Leung,
Li Qin
Publication year - 2003
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.11194
Subject(s) - bent molecular geometry , discontinuity (linguistics) , microwave , simple (philosophy) , coaxial , engineering , geometry , structural engineering , acoustics , mathematical analysis , physics , mathematics , electrical engineering , telecommunications , philosophy , epistemology
Abstract A method for full‐wave modeling of the exterior structure of vertical via, which considers the actual layout of an exterior structure with pad and vertical bent into the via, is presented. This method is more accurate than simple coaxial cable feed‐in and thin‐wire approximation because it takes into account the effect of pad and vertical bent. Good results are obtained for structures and frequencies where thin‐wire approximation no longer stands. Combined with interior formulation developed in a previous paper, we illustrate the propagation characteristics of multilayered vertical via and multivia geometry. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 39: 290–295, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11194