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Analysis of signal propagation on high‐speed planar interconnect systems based on full‐wave and macromodeling techniques
Author(s) -
Liu EnXiao,
Li ErPing,
Li LeWei
Publication year - 2003
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.11163
Subject(s) - spice , subnetwork , electronic engineering , admittance , interconnection , transfer function , planar , finite difference time domain method , signal integrity , time domain , signal (programming language) , rational function , propagation delay , computer science , equivalent circuit , engineering , electrical engineering , electrical impedance , telecommunications , mathematics , physics , voltage , mathematical analysis , computer graphics (images) , computer security , quantum mechanics , computer vision , programming language
An accurate and systematic approach for the analysis of signal propagation at high‐speed planar interconnect systems is proposed in this paper. The approach integrates a macromodeling technique based on the full‐wave time domain method and rational function approximation together with the SPICE circuit simulation. The admittance Y transfer function in the form of a set of discrete frequency sampling data is established by using the full‐wave finite‐difference time‐domain (FDTD) method, which characterizes the high‐speed planar interconnect subnetwork. Thereafter, the macromodel of the interconnect subnetwork is constructed through rational function approximation by using the Vector fitting method, which results in an accurate and robust solution for the overall problem. Subsequently, the resultant macromodel can be synthesised and converted to a SPICE‐compatible equivalent circuit. Therefore, the signal propagation analysis is finally facilitated and expedited by using the SPICE circuit simulator. Numerical experiments are presented in this paper to verify the accuracy and efficiency of the proposed method. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 39: 183–187, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11163