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Relationship between the propagation characteristics of via and microstrip connecting angle
Author(s) -
Ji Wusheng,
You Bin,
Wang Xuedong,
Li Ying
Publication year - 2003
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.11021
Subject(s) - microstrip , microwave , electronic engineering , interconnection , engineering , electrical engineering , telecommunications
The microstrip‐via‐microstrip is a popular interconnect structure in multilayer circuits at microwave frequency. The microstrip connecting angle is an arbitrary angle due to layout and technical error. The relationship between the propagation characteristics of via and the microstrip connecting angle was analyzed by using the Ansoft simulator. The obtained results have important application value for the design of a similar multilayer circuit. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 38: 225–228, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11021