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LTCC broadband deep embedded interconnects (DEI) with application for embedded bandpass filter
Author(s) -
Yu J. J.,
Tan B. T.,
Chew S. T.
Publication year - 2003
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.11007
Subject(s) - insertion loss , return loss , band pass filter , microwave , coplanar waveguide , stripline , broadband , materials science , optoelectronics , substrate (aquarium) , electronic circuit , filter (signal processing) , ceramic , engineering , electrical engineering , electronic engineering , telecommunications , oceanography , antenna (radio) , composite material , geology
Careful design of via transitions intended for use in practical microwave applications is needed to realize the advantages of low‐temperature co‐fired ceramic (LTCC), such as highly integrated buried passive circuits. Grounded coplanar waveguide (GCPW) to asymmetrical stripline vertical interconnects is optimized for thick LTCC substrate. The focus is to develop a vertical transition through thick substrate supporting deep embedded interconnects (DEI). The measured results demonstrate vertical transitions with good performance up to 20 GHz. Embedded LTCC bandpass filter with such vertical transition has been demonstrated with an insertion loss of 2.2 dB and return loss better than −20 dB at 16.2 GHz. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 38: 179–181, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11007