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Electromagnetic interconnection between microstrip lines through a thick ground plate
Author(s) -
Lee Byungje,
Park MyunJoo
Publication year - 2003
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.10792
Subject(s) - finite difference time domain method , microstrip , interconnection , microwave , microstrip antenna , coupling (piping) , parametric statistics , bandwidth (computing) , engineering , electronic engineering , broadband , moment (physics) , ground plane , acoustics , optics , electrical engineering , antenna (radio) , physics , telecommunications , mathematics , mechanical engineering , statistics , classical mechanics
Understanding of electromagnetic coupling is an important area of research in the design and development of multi‐layered antenna arrays. In this paper, the spectral domain moment method (SDMM) is developed to investigate the coupling between two microstrip lines through a circular waveguide in a thick common‐ground plate. Measured data, along with the results obtained from the finite‐difference time‐domain (FDTD) method, are used to verify the solution. A parametric study illustrates the coupling behavior of the structure under investigation. It is observed that the frequency tuning and wide frequency bandwidth can be achieved by choosing the appropriate geometry, and this type of transition can be significantly affected by structural parameters. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 36: 467–471, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.10792