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Numerical modeling of microstriplines with substrates with arbitrarily varying thickness with the use of the TLM method
Author(s) -
Ahyoud S.,
El Moussaoui A.,
Essaaidi M.,
Khalladi M.
Publication year - 2002
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.10369
Subject(s) - microstrip , microwave , computation , electrical impedance , substrate (aquarium) , propagation constant , node (physics) , characteristic impedance , materials science , electronic engineering , scattering parameters , engineering , topology (electrical circuits) , acoustics , mathematical analysis , physics , computer science , mathematics , electrical engineering , telecommunications , algorithm , oceanography , geology
The symmetrical condensed‐node TLM method is used for the analysis of microstrip lines with substrates of arbitrary varying thickness. This numerical technique has been efficiently used for the computation of the propagation constant and the characteristic impedance of this structure. Moreover, it has been demonstrated that the shape of the microstrip substrate is also an important parameter for controlling the values of its characteristic impedance. The validity of the obtained results is proved by comparisons with those obtained from the literature. © 2002 Wiley Periodicals, Inc. Microwave Opt Technol Lett 34: 48–51, 2002; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.10369