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Design and analysis of integrated‐circuit package antenna (ICPA) for dual‐band wireless transceivers
Author(s) -
Tong MingSze,
Yang Mingwu,
Cao Qunsheng,
Kim HyeongSeok,
Lu Yilong,
Chen Yinchao,
Chang TaeGyu
Publication year - 2006
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.21049
Subject(s) - hfss , transceiver , antenna (radio) , multi band device , electronic circuit simulation , electronic engineering , electrical engineering , miniaturization , finite difference time domain method , wireless , return loss , engineering , computer science , electronic circuit , microstrip antenna , telecommunications , physics , optics
This article presents study of a dual‐band integrated‐circuit package antenna (ICPA), which operates concurrently on dual bands at 2.4 and 5.25 GHz. The antenna is designed and printed on the top surface of an IC package and fed by a single coaxial line, while the transceiver is implemented on the opposite side of the package, through the separation of a common ground plate. This “cavity‐down” arrangement minimizes the electromagnetic interference between the antenna and transceiver, and satisfies the miniaturization of the design. The study consists of numerical computations, which are performed through an in‐house computer solver based on the nonuniform finite‐difference time‐domain (NU‐FDTD) method and experimental measurements. Together with the data computed using the high‐frequency structure simulator (HFSS) software, the results show excellent agreement between the numerical and experimental data, and the proposed structure is deemed as a useful application in the area of highly integrated wireless transceivers. © 2006 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2006.