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Recent advances in theory and applications of substrate‐integrated waveguides: A review
Author(s) -
Sahu Abhishek,
Devabhaktuni Vijay K.,
Mishra Rabindra K.,
Aaen Peter H.
Publication year - 2016
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.20946
Subject(s) - printed circuit board , microwave , interconnection , electronic circuit , integrated circuit , extremely high frequency , optoelectronics , substrate (aquarium) , materials science , monolithic microwave integrated circuit , electronic engineering , electrical engineering , computer science , engineering , telecommunications , cmos , oceanography , geology , amplifier
The use of substrate integrated waveguides (SIW) for microwave and millimeter wave integrated components has increased dramatically over the last decade. They mimic the performance of conventional metallic waveguides and they are fabricated using printed circuit boards using the top and bottom metallization with two rows of vias forming the side walls. This creates a low profile, compact, and light weight alternative to conventional metallic waveguides, and they allow a direct interconnection with printed circuit boards and active components. This article reviews the fundamental theory, documents the research that has been performed over the past decade, and summarizes progress up to the recent state‐of‐the‐art including novel SIW structures for passive circuits and antennas as well as new applications for reconfigurable and printed circuits using SIW technology. © 2015 Wiley Periodicals, Inc. Int J RF and Microwave CAE 26:129–145, 2016.