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Circuit model and signal integrity analysis for multilayer printed circuit board interconnection
Author(s) -
Kong Fan,
Sheng Weixing,
Ma Xiaofeng,
Han Yubing
Publication year - 2014
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.20789
Subject(s) - feko , equivalent circuit , signal integrity , printed circuit board , interconnection , scattering parameters , microstrip , partial element equivalent circuit , electronic engineering , topology (electrical circuits) , electronic circuit simulation , computer science , engineering , electronic circuit , software , electrical engineering , telecommunications , voltage , programming language
A circuit modeling method and signal integrity analysis approach for multilayer printed circuit board interconnection based on the partial equivalent element circuit (PEEC) method is proposed. The multilayer interconnection structure is divided into a via hole and microstrip lines. A three‐dimensional (3D) model of a via hole structure is constructed using the PEEC method with Rao–Wilton–Glisson (RWG) basis functions. The microstrip lines on the top and bottom layers are modeled by PEEC method with RWG basis functions and discrete complex image. The model order reduction method is used to analyze effectively the via hole structure. The equivalent circuit of the via hole structure is simplified, and its physical meaning is defined. The scattering (S) parameter obtained from the proposed method is consistent with simulation results, which are computed using the commercial 3D electromagnetic field analysis software FEKO. The correctness of the proposed method is validated. The S parameters of different dimensions are simulated, and the effects of these dimensions on the electromagnetic characteristics of the via hole structure are analyzed. The model of the entire structure is used to conduct eye diagram simulation. © 2013 Wiley Periodicals, Inc. Int J RF and Microwave CAE 24:478–489, 2014.