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Return loss and crosstalk mitigation in coupled vias for modern high‐speed packaging
Author(s) -
HernandezSosa Gaudencio,
TorresTorres Reydezel,
Sanchez Adan
Publication year - 2012
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.20594
Subject(s) - return loss , crosstalk , microwave , electrical impedance , electronic engineering , materials science , insertion loss , electrical engineering , optoelectronics , computer science , engineering , telecommunications , antenna (radio)
A method for mitigating the return loss and crosstalk corresponding to coupled vias is presented in this article. The method is based on selecting the proper dimensions for the antipad holes related to vias as well as the most adequate distribution of the ground vias, which allows to simultaneously reducing impedance mismatch and undesirable via coupling. The usefulness of the method is demonstrated by improving the performance of a 2 × 3 array of six signal vias. As a result, return loss levels below −45 dB and crosstalk levels below −40 dB are obtained in the 0–50 GHz frequency range. © 2011 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2012.