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Far‐end crosstalk reduction in PCB interconnects using stepped impedance elements and open‐circuited stubs
Author(s) -
Almalkawi Mohammad,
Devabhaktuni Vijay
Publication year - 2011
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.20547
Subject(s) - printed circuit board , electrical impedance , capacitive sensing , crosstalk , electronic engineering , microwave , electromagnetic interference , electrical engineering , engineering , computer science , telecommunications
In this work, new trace configurations using stepped impedance elements and open‐circuited stubs to reduce far‐end crosstalk in printed circuit board (PCB) interconnects are introduced. The goal of this study is to reduce crosstalk without using additional PCB components in the design. Specifically, we use stepped impedance elements and open‐circuited stubs of uniform length and width on the victim traces to suppress high‐frequency electromagnetic interference and to equalize propagation delays or capacitive and inductive couplings between PCB traces. The overall design is very similar to the usual low‐pass filter configurations, which are difficult to implement in the prototype testing. The proposed approach shows remarkably better results when compared with conventional intervening guard trace schemes. © 2011 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2011.