z-logo
Premium
CMOS stacked folded differential structure power amplifier for high power RF application
Author(s) -
Luque Yohann,
Kerhervé Eric,
Deltimple Nathalie,
Leyssenne Laurent,
Belot Didier
Publication year - 2010
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.20465
Subject(s) - amplifier , cmos , dbm , rf power amplifier , power (physics) , electrical engineering , linearity , power gain , power bandwidth , topology (electrical circuits) , electronic engineering , linear amplifier , power added efficiency , materials science , engineering , physics , quantum mechanics
This article describes the feasibility of a Power Amplifier (PA) in 0.13 μm CMOS technology from STMicroelectronics for high power applications. To obtain a high output power with a good linearity, a new topology called Stacked Folded Differential Structure (SFDS) is proposed. It allows obtaining similar power performances to a PA with DAT in a lower die area. This PA provides 23 dBm of maximum output power ( P max ) with 20% of power added efficiency (PAE) at 1.95 GHz. The linear gain is equal to 11 dB and the output power at 1 dB compression point (OCP 1 ) achieves 21 dBm. © 2010 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2010.

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom